Overview:
OEM Gold Plating Copper IC Lead Frame for Semiconductor Applications are high-precision components engineered for use in semiconductor packaging. Crafted from high-quality copper, these lead frames undergo advanced progressive stamping processes to deliver exceptional strength and accuracy. A layer of gold plating is applied to enhance both electrical conductivity and corrosion resistance, ensuring reliable performance in demanding electronic and semiconductor applications. Ideal for microelectronics, integrated circuits (ICs), and other critical devices, our lead frames are fully customizable, with OEM services available to meet your specific requirements. Partner with us to achieve optimal performance, reliability, and durability for your semiconductor packaging needs.
Basic Information:
| Attribute | Details |
|---|---|
| Material | Copper (with Gold Plating) |
| Place of Origin | Xiamen, China |
| Brand Name | OEM |
| Drawing Format | 2D (PDF/CAD) / 3D (IGES/STEP) |
| Application | Semiconductor, Microelectronics |
| Service | Customized OEM |
| Processing Type | Progressive Stamping |
| Color | Customized (Gold Plating) |
| Tolerance | ±0.01 – 0.05mm |
| Package | Custom |
| Sample | Available |
| Certification | ISO 9001, RoHS, IATF 16949 |
Surface Treatment Options:
- Gold Plating: A high-quality electroplated gold finish that enhances conductivity, improves corrosion resistance, and offers superior performance for semiconductor applications.
- Nickel Plating: Provides excellent corrosion resistance and durability, ideal for long-term applications requiring enhanced material protection.
- Electroplating: Offers consistent metal deposition, improving both the durability and aesthetic qualities of the lead frames.
- Tin Plating: Used for ensuring excellent solderability and oxidation resistance, crucial for electronic component longevity.
Benefits of Our IC Lead Frames:
- High Electrical Conductivity: Gold plating offers superior conductivity, reducing signal loss and improving the overall performance of semiconductor devices.
- Superior Corrosion Resistance: The gold-plated layer ensures long-term resistance to corrosion and degradation, ensuring reliable performance in harsh environments.
- Precision Stamping: Our advanced progressive stamping processes ensure micron-level precision, producing lead frames with tight tolerances, ideal for delicate semiconductor applications.
- Customizable Solutions: Tailored designs for specific application requirements, with customizable sizes, shapes, and gold-plating thicknesses to meet unique customer needs.
Factory Show:
Our facility is equipped with state-of-the-art technologies, including 25 high-performance punch presses (ranging from 25 to 300 tons), precision wire EDM machines, advanced grinding systems, and top-tier welding, polishing, and ultrasonic cleaning equipment. These resources enable us to deliver superior finish quality and cleanliness.
Additionally, we offer an extensive range of metal plating services, including gold plating, nickel plating, and electroplating, providing consistent coatings that enhance performance and comply with the highest industry standards.
Our ISO 9001 and IATF 16949 certifications guarantee rigorous quality control, ensuring precise fabrication and reliable product performance. Fully automated production lines, supported by advanced inspection tools such as 3D projectors, sealing testers, durometers, and elasticity gauges, further optimize manufacturing, ensuring consistent results and meeting the most stringent industry requirements.
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